ꂃ ꁹ
Technical Specifications
ITEM Stand Advanced Standard Advanced
PANEL SIZE Maximum 700*800 800*1200mm 28*32Inch 32*47Inch
BOARD THICKNESS Maximum 7mm 12mm 0.28Inch 0.47Inch
Minimum 0.4mm 0.2mm 0.016Inch 0.008Inch
LAYER COUNT Maximum layer count rigid boards 36 40 36 40
Maximum layer count flex boards 10 16 10 16
LAYER TO LAYER REGISTRATION minimum missregistration 0.1mm 0.075mm 4mil 3mil
FINISHED COPPER Maximum thickess 245um 700um 7oz 20oz
LINES/SAPCES Minimum outer layer line/sapce 75/75umum 50/50um 3/3mil 2/2mil
Minimum inner layer line/space 75/75um 50/50um 3/3mil 2/2mil
MECHANICAL DRILLING Maximum aspect ratio 1:10 1:16 1:10 1:16
Max drill diameter 0.15mm 0.1mm 6mil 4mil
Final hole tolerance(PTH) +/-0.076mm +/-0.05mm +/-3mil +/-2mil
Final hole tolerance(NPTH) +/-0.05mm +/-0.05mm +/-2mil +/-2mil
Hole location accuracy +/-0.05mm +/-0.05mm +/-2mil +/-2mil
LASER DRILLING Minimum laser drill 0.1mm 0.075mm 4mil 3mil
Aspect ratio Microvia 1:0.8 1:1 1:0.8 1:1
IMPEDANCE CONTROL Accuracy +/-10% +/-5% +/-10% +/-5%
BOW&TWIST Tolerance +/-0.75% +/-0.5% +/-0.75% +/-0.5%
GOLD FINGERS Maximum length 40mm 40mm 1.5inch 1.5inch
Minimum spacing 0.15mm 0.15mm 6mil 6mil
BOARD PROFILE Minimum thickness for V-scoring 0.6mm 0.4mm 24mil 16mil
V-scoring registration 0.1mm 0.1mm 4mil 4mil
Beveling tolerance +/-5degree +/-3degree +/-5degree +/-3degree
Slot tolerance +/-0.1mm +/-0.075mm +/-4mil +/-3mil
Edge routing tolerance +/-0.1mm +/-0.075mm +/-4mil +/-3mil

 

FINAL FINISHING

Soft gold
Hard gold
OSP
ENIG
HAL
LF HAL
Immersion tin
Immersion silver
ENEPIG

Selective surface finish

TECHNOLOGIES

Rigid flex boards  including Semi and Regal flex
Flex boards and multi flex
HDI  Including blind and buried vias
Back Planes
Load and Test boards
Radio Frequency boards  Including Teflon and Arlon Hybred materials PCB
Signal integrity and high speed boards
Halogen-free materials PCB
Metal core PCB boards
Thermal management
Coin boards

PCB Manufacturing